We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications.
| Published in | International Journal of Materials Science and Applications (Volume 3, Issue 3) |
| DOI | 10.11648/j.ijmsa.20140303.12 |
| Page(s) | 84-87 |
| Creative Commons |
This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited. |
| Copyright |
Copyright © The Author(s), 2014. Published by Science Publishing Group |
Direct-Write Fabrication, Silver Seed Layer, Characterization
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APA Style
Alu, Noble O., Oberafo, Anthony A., Iwok, et al. (2014). Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. International Journal of Materials Science and Applications, 3(3), 84-87. https://doi.org/10.11648/j.ijmsa.20140303.12
ACS Style
Alu; Noble O.; Oberafo; Anthony A.; Iwok, et al. Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. Int. J. Mater. Sci. Appl. 2014, 3(3), 84-87. doi: 10.11648/j.ijmsa.20140303.12
AMA Style
Alu, Noble O., Oberafo, Anthony A., Iwok, et al. Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates. Int J Mater Sci Appl. 2014;3(3):84-87. doi: 10.11648/j.ijmsa.20140303.12
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Download@article{10.11648/j.ijmsa.20140303.12,
author = {Alu and Noble O. and Oberafo and Anthony A. and Iwok and Unwana U. and Adama and Kenneth K. and Imalerio and Thomas I.},
title = {Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates},
journal = {International Journal of Materials Science and Applications},
volume = {3},
number = {3},
pages = {84-87},
doi = {10.11648/j.ijmsa.20140303.12},
url = {https://doi.org/10.11648/j.ijmsa.20140303.12},
eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.ijmsa.20140303.12},
abstract = {We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications.},
year = {2014}
}
TY - JOUR T1 - Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates AU - Alu AU - Noble O. AU - Oberafo AU - Anthony A. AU - Iwok AU - Unwana U. AU - Adama AU - Kenneth K. AU - Imalerio AU - Thomas I. Y1 - 2014/05/20 PY - 2014 N1 - https://doi.org/10.11648/j.ijmsa.20140303.12 DO - 10.11648/j.ijmsa.20140303.12 T2 - International Journal of Materials Science and Applications JF - International Journal of Materials Science and Applications JO - International Journal of Materials Science and Applications SP - 84 EP - 87 PB - Science Publishing Group SN - 2327-2643 UR - https://doi.org/10.11648/j.ijmsa.20140303.12 AB - We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications. VL - 3 IS - 3 ER -
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